5G mobile networks

Articles

A platform for testing the performance of new telecom systems

The POM project brought together researchers from Télécom Paris, part of the Carnot TSN institute, and Nokia Bell Labs to model and evaluate telecoms systems. This collaboration was based on the use of the TTOOL platform, accredited by the Carnot TSN institute.
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Back to the Rendez-vous Carnot 2025 in Lyon

On October 15 and 16, 2025, the Carnot TSN Institute took part in the Rendez-vous Carnot 2025, held at the Lyon Convention Center. This event, which has become a must for partnership research and innovation, brought together several thousand participants from all over France to develop new collaborations between public research and industry.

A look back at the participation of ITM, pilot of the TSN Carnot, at the Paris Air Show.

Once again this year, the Institut Mines-Télécom (IMT), which runs the TSN Carnot Institute, took part in the Paris Air Show 2025, a major event in the aerospace sector. Until June 22, the IMT was present alongside its industrial partner ESARIS INDUSTRIES, to present its training courses, research activities, technology platforms and incubators.

The ITM, leader of the Carnot TSN, is a partner in Univity's new-generation space program, hailed by the Élysée Palace.

The Carnot Télécom & Société numérique institute, led by ITM, is pleased to highlight ITM's involvement in an ambitious space project led by Univity (formerly Constellation Technologies): an innovative French company with a far-reaching ambition: to create a constellation of satellites to support next-generation mobile telecommunications networks, in particular 5G and the future 6G.
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XAI-4-AML Chair: how can AI help combat money laundering?

The fight against money laundering and the financing of terrorism (LCB-FT) requires financial institutions to implement systems to identify potential illegal transactions. Since 2020, Télécom Paris, part of the Carnot TSN institute, has hosted the XAI-4-AML research chair. This aims to understand how artificial intelligence could help improve the fight against money laundering and the financing of terrorism.
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Back to Carnot TSN's participation in Global Industrie 2025

From March 11 to 14, 2025, Eurexpo Lyon was the venue for the Global Industrie trade show, bringing together over 50,000 professionals and 2,500 exhibitors. Under the theme "People at the heart of industry", this year's event featured major technological innovations, technical competitions and strategic exchanges. The Carnot Network and its institutes, including the Carnot TSN institute, took pride of place.
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BOPA: digital innovation meets the operating theatre

The BOPA Chair, the result of collaboration between AP-HP and ITM, via the component schools of Carnot TSN, is developing digital solutions to improve working conditions in the operating room, by combining technology and an understanding of human practices. Read our article.
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[VIDEO] Discover the RAMSES platform at Télécom Paris

RAMSES is a platform dedicated to the design of real-time critical embedded systems. The Carnot institute Télécom & Société numérique visited Télécom Paris, where the platform is located, to interview RAMSES researchers on the various aspects of its technologies. Discover their interviews on video.
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[FOCUS 5G/6G] From 5G to 6G: the inexorable advance of generations

The Carnot TSN institute invites you to discover a variety of insights into the technical challenges, as well as optimization and sobriety issues, that accompany the transition from 5G to 6G.
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ICMS Chair: enhancing the safety of connected vehicles

In February 2024, Télécom Paris launched the Intelligent Cybersecurity for Mobility System (ICMS) Chair. This initiative follows on from the work carried out within the framework of the Connected Cars and Cyber Security (C3S) chair, with the aim of deepening the knowledge produced and boosting the visibility of Télécom Paris and its partners within the scientific community, through first-rate publications directly linked to the needs of industry in the field.